Milestone
Milestone
2020

Launched thermosiphon Assisted Enclosure used for cooling 5G AAU, a brand new equipment applied on 5G outdoor base station featuring high performance and effective heat transferring

Up-to-Date the certificate of Dun & Bradstreet D-U-N-S ® Registered ™ with No. 65-750-8842

2019

Awarded CommonWealth Magazine Taiwan’s 50 Fastest Growing Company #38

Awarded CommonWealth Magazine Top 2000 manufacturers #535

Awarded CommonWealth Magazine Top 2000 Computers and Peripheral Equipment Manufacturers #67

Launched high power ultra-thin vapor chamber featuring extreme heat transfer and low thermal resistance in less space

Annual sales revenue hit record high NT$4.67 billion

2018

Awarded CommonWealth Magazine Top 2000 manufacturers #689

Awarded CommonWealth Magazine Top 2000 Computers and Peripheral Equipment Manufacturers #79

Launched advanced thermal solution applied on hyper-scale data center and cloud computing server to deal with high power CPU & GPU accompanied with high heat load issue

Launched high performance ultra-slim heat pipe used on smartphone to sustain full time power supply and CPU operation

Established Siyang (China) TaiSol Manufacturing Site

Annual sales revenue reached NT$3.45 billion, 13% YoY growth

Increased capital to NT$864 million

2017

Awarded CommonWealth Magazine Top 2000 manufacturers #726

Awarded CommonWealth Magazine Top 2000 Computers and Peripheral Equipment Manufacturers #81

Launched vapor chamber assembled heat sink which can be extended to exceed the width of the heat source, allowing further heat transfer performance and Q-max benefits

Deployed thermal application in SA/NSA 5G network infrastructure, developed a serious of product line widely used on 5G supply chain of telecom, clouding computing and terminal devices.

Annual sales revenue reached NT$3.0 billion

Increased capital to NT$697 million

2016

Launched liquid cooling solution by using cold plate and liquid cooling system to reduce heats through circulation of water or liquid

Annual sales reached NT$2.87 billion, 13% YoY growth

Increased capital to NT$696 million





2015

Entered into enterprising computing industry, developed high power and high performance thermal management solution to apply on server, storage, cloud computing, and data center

Annual sales revenue reached NT$2.55 billion

Increased capital to NT$697.9 million

2014

TaiSol was certified with D&B D-U-N-S® Registered ™ Certificate with No. 65-750-8842.

Annual sales revenue reached NT$2.63 billion

Increased capital to NT$697.7 million





2013

Listed for IPO in Taiwan stock market with US$24M paid-in capital

2012

Going Industrial Thermal Management

Providing the industry’s broad product offering up to several thousand kilowatt industrial applications.

● Power Inverter (IGBT) cooling application(Elevator, Train, Electrical Vehicle)

● High Power LED downlight cooling solutions

● Industrial Robot

2010

Moving to Enterprise Computing Application

Offering a variety of high power semiconductor cooling solutions to improve efficiency of IT structure featured by limited sizes and raised thermal loads including enterprise computing & storage, server systems, public cloud computing, and work stations.

2007

TaiSol ranked #86 in Taiwan's Top 100 in Patent Ownership and #4 in the category of electronic connector in Taiwan.

2006

Completed all global green environment requirements on both Dong Guan & Suzhou facilities.

2005

TaiSol won qualification from Dell to provide heat pipes into applications.





2004

TaiSol won 'Honor Award of Golden Torch Award Selection, R.O.C'

2003

TaiSol Japan Sale & Marketing office established to extend engineering expertise into new markets.









2002

Manufacturing facility estblished in Suzhou China to produce heat pipes and apply on thermal applications.

2001

TaiSol expanded production capabilities by established manufacturing facility for cooler, connector and cable assemblies in Dong Guan, China






1999

TaiSol USA Sale & Marketing established to drive faster growth and better serve customers

1997

R&D Center and assembly lines established offering innovative thermal management solution and a versatile range of connector options.

1996

Developed sintered wick structure heat pipe enhanced and standardized into a reliable product

1994

TaiSol was founded to develop and realize thermal technology & portfolio of interconnect products.